2024 affordable Emcp

Custom-Made BGA, FBGA, EMMC, and Socket Adapters: ALLSOCKET IC Testing Solutions for Varied Pitch Sizes Including 0.4mm, 0.5mm, 0.65mm, 0.8mm, and 1.37mm, as well as Irregular Pitch Configurations

Price: $2.00

ALLSOCKET-BGA939-C-0.4mm Pitch, Fully Pinned, Clamshell-Style Socket

CUSTOMIZATION AVAILABLE: Tailored BGA Series Packaging Solutions, Incorporating Clamshell Design with Complete Pin Configuration

PITCH VARIATIONS: Accommodating 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.0mm, and Non-Standard Pitch Configurations

MATERIAL COMPOSITION & SURFACE TREATMENT: Housing Constructed from PEI; Contacts Fabricated from Beryllium Copper; Coated with Gold over Nickel for Enhanced Durability

PRODUCTION TURNAROUND TIME: Typically 3-5 Business Days (For Detailed Information and Orders, Kindly Contact Us)

The BGA FBGA EMMC EMCP Socket Adapter, which features ALLSOCKET IC Testing Socket, offers a range of pitches including 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.73mm, and custom pitches for irregular configurations.

Price: $2.00

The ALLSOCKET-BGA975-C-0.4mm Pitch, Full Pins, Clamshell Socket offers a unique customized service.

We provide BGA series package customized sockets in the clamshell style, with the option of full pins.

Our sockets are available in a range of pitches, including 0.4mm, 0.5mm, 0.65mm, 0.8mm, and 1.0mm, as well as irregular pitches to meet your specific needs.

Regarding materials and finish, the housing is made of PEI, while the contacts are constructed from beryllium copper.

Additionally, the plating is gold plated over nickel for superior conductivity and durability.

When it comes to manufacturing lead time, we aim to deliver within 3-5 business days.

However, please contact us for more detailed information before placing your order to ensure accurate timing and fulfillment of your requirements.

The BGA FBGA EMMC EMCP Socket Adapter, featuring a diverse range of pitches including 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.46mm, and customized irregular pitches, offers a comprehensive solution for ALLSOCKET IC Testing Socket needs.

Price: $2.00

ALLSOCKET-BGA948-C-0.4mm Pitch, Full Pin Configuration, Clamshell Design Socket

BESPOKE SOLUTIONS: TAILOR-MADE BGA SERIES PACKAGE SOCKETS, ADOPTING THE CLAMSHELL APPROACH WITH FULL PIN AVAILABILITY

PITCH VARIATIONS: RANGE FROM 0.4mm, 0.5mm, 0.65mm, 0.8mm, TO 1.0mm, INCLUDING NON-STANDARD PITCHES

CONSTRUCTION MATERIALS & SURFACE TREATMENT: CASING MADE OF PEI; UTILIZING BERYLLIUM COPPER FOR CONTACTS; GOLD PLATING OVER NICKEL FOR SUPERIOR DURABILITY

PRODUCTION LEAD TIME BY THE MANUFACTURER: APPROXIMATELY 3-5 BUSINESS DAYS (PLEASE INQUIRE FOR ADDITIONAL INFORMATION PRIOR TO PLACING YOUR ORDER)

Anncus 6-in-1 Universal Testing Device Compatible with eMMC and eMCP Chips, Including eMMC153/169 and eMCP162/186/221/529 for Retrieving Data from Android Smartphones

Price: $473.45

The Package Contains: 1 unit of USB 3.0 box | 4 units of sockets | 4 printed circuit boards compatible with eMMC153, 169, eMCP162, 189, eMCP221, and eMCP529 | 5 size limiters (11.5X13mm, 12X16mm, 12X18mm, 14X18mm, 15X15mm) | Additional accessories can be purchased by sending me a message.

Originating from: China

Condition: Brand New

Type: Drive Integrated Circuit

Universal 6-in-1 USB 3.0 Test Socket: Supports EMMC153, 169, EMCP162, 189, EMCP221, and EMCP529 NAND flash memory chips.

Please note: This product features a single socket/adapter that is compatible with four printed circuit boards.

The P

The Amaoe 4-in-1 EMMC/EMCP/UFS BGA Reballing Jig Platform is an innovative solution designed specifically for BGA153, BGA162, BGA221, and BGA254 chip IC soldering stations. This comprehensive platform features a tin planting template that streamlines the

Price: $52.99

Absolutely authentic and supreme in quality, every component of our steel materials boasts of being manufactured in Japan.

Our BGA Reballing Jig Platform Kits offer seamless heating functionality with a hot air machine, ensuring that the stencils maintain their shape and structure even under intense heat.

Introducing the Amaoe 4 in 1 EMMC/EMCP/UFS BGA Reballing Platform, a comprehensive solution for BGA153, BGA162, BGA221, and BGA254 Chip IC Soder Station Tin Planting Template BGA Platform Reballing Kits Repair ToolsWelding Template.

This versatile tool is ideal for a wide range of applications, particularly in telephone repair shops where precision and durability are paramount.

We pride ourselves on offering only 100% genuine products.

If you're not completely satisfied with our products, we're confident that you'll find them to be of the highest quality and performance.