Knowledge System of Semiconductor Manufacturing Industry

1、 Key materials required for semiconductor manufacturing

Silicon wafer: As the basic material for semiconductor chip manufacturing, silicon wafer is one of the essential raw materials for chip manufacturing.

Mask: Mask is one of the key materials for manufacturing chips, used for the circuit structure of chips.

Chemicals: including various types of gases, solutions, and solids, used in corrosion, cleaning, and coating processes in chip manufacturing.

Photoresist: Used for photoresist coating in the lithography process, it is one of the essential materials in the manufacturing of chips.

Metal materials: including copper, aluminum, tungsten and other metal materials, used in the manufacturing of wires, connectors and other structures for chips.

Wafer adhesive: Wafer adhesive is used to fix silicon wafers and is an indispensable material in the chip manufacturing process.

Rare earth materials: including various rare earth elements such as lutetium, cerium, and praseodymium, used in the manufacturing of semiconductor devices such as LEDs and photovoltaic cells.

Overall, semiconductor manufacturing requires the synergistic effect of multiple key materials, with silicon wafers and masks being the most fundamental key materials, while other materials play different roles and play important roles in the chip manufacturing process.

2、 Common core technologies that the semiconductor industry needs to master

Lithography technology: Used to form micro circuit patterns on silicon wafers, high-precision lithography technology is required.

Silicon wafer manufacturing technology: including wafer production, chemical mechanical polishing, defect removal and other technologies, it is necessary to master technologies such as high-purity silicon wafer manufacturing and polishing.

Etching technology: used for micron level processing on silicon wafers, requiring mastery of high-precision etching technology.

Cleaning technology: used to clean silicon wafers and remove impurities, it is necessary to master efficient and high-precision cleaning technology.

Nano processing technology: used for nano level processing on silicon wafers, high-precision nano processing technology needs to be mastered.

Materials science: Research and mastery of semiconductor materials, insulation materials, metal materials, etc. require mastery of advanced materials science and technology.

Packaging technology: For packaging chips into plastic or ceramic packaging to protect them, it is necessary to master efficient and high-precision packaging technology.

Chip testing technology: For testing chip performance and reliability, it is necessary to master high-precision and efficient testing techniques.

In addition to the above technologies, it is also necessary to master knowledge in microelectronics, integrated circuit design, power electronics, and other fields. These technologies and knowledge are interrelated and together constitute the core technology system of the semiconductor industry.

3、 Common advanced equipment required by the semiconductor industry

Lithography machine: used to print chip circuit patterns onto silicon wafers.

Etching machine: used for fine processing on silicon wafers to form circuit patterns.

Chemical Vapor Deposition Equipment (CVD): Used for depositing thin films on the surface of silicon wafers.

Plasma Etching Equipment (RIE): Used for micron level machining on silicon wafers.

Ion implantation equipment: used to inject impurities into silicon wafers and change the electrical properties of the wafers.

Cleaning equipment: used to clean silicon wafers and remove impurities from them.

Packaging equipment: used to package chips into plastic or ceramic packaging to protect them.

4、 Application scenarios of gallium nitride (GaN) in semiconductor manufacturing

Gallium nitride (GaN) is a new type of semiconductor material, widely used in the field of semiconductor manufacturing due to its special physical properties, especially in high-power and high-frequency applications. Its functions are as follows:

High efficiency: Gallium nitride has a high electron mobility and saturation drift speed, which enables high-speed electron transfer and improves the efficiency of the device.

High frequency: Due to the fast electronic movement speed of gallium nitride, it can work at higher frequencies, making it widely used in high-frequency applications such as radar, wireless communication, and high-speed computing.

High voltage resistance: The electronic band structure of gallium nitride gives it higher voltage resistance and can be used for high-voltage applications.

High temperature performance: Gallium nitride can work stably at high temperatures, so it can be used for high-temperature applications.

LED manufacturing: Gallium nitride materials are widely used in the manufacturing of LEDs (light emitting diodes), with advantages such as high brightness, high efficiency, and long lifespan.